Industrial automation systems and integration — Product data representation and exchange — Part 1688: Application module: Interconnect non planar shape

ISO/TS 10303-1688:2006 specifies the application module for Interconnect non planar shape.

The following are within the scope of ISO/TS 10303-1688:2006:

• three dimensional manifold surface representation of an interconnect substrate;
• placement of footprint and other planar feature definitions in a three dimensional manifold surface representation including changing the planar shape to a manifold shape.