ISO 9453:2014Withdrawn

Soft solder alloys — Chemical compositions and forms

Alliages de brasage tendre — Compositions chimiques et formes

This edition has been replaced by ISO 9453:2020.

Abstract / scope

ISO 9453:2014 specifies the requirements for chemical composition for soft solder alloys containing two or more of tin, lead, antimony, copper, silver, bismuth, zinc, indium and/or cadmium.

Life cycle

Replaces

ISO 9453:2006WithdrawnSoft solder alloys — Chemical compositions and formsInternational Standard · Published 22 Sep 2006 · ISO/TC 44/SC 12

Replaced by

ISO 9453:2020PublishedSoft solder alloys — Chemical compositions and formsInternational Standard · Published 24 Sep 2020 · ISO/TC 44/SC 12