ISO 9455-5:2014Withdrawn

Soft soldering fluxes — Test methods — Part 5: Copper mirror test

Flux de brasage tendre — Méthodes d'essai — Partie 5: Essai au miroir de cuivre

This edition has been replaced by ISO 9455-5:2020.

Abstract / scope

ISO 9455-5:2014 specifies a qualitative method for assessing the aggressiveness of a flux towards copper. The test is applicable to all fluxes of type 1 as defined in ISO 9454‑1.

Life cycle

Replaces

ISO 9455-5:1992WithdrawnSoft soldering fluxes — Test methods — Part 5: Copper mirror testInternational Standard · Published 16 Apr 1992 · ISO/TC 44/SC 12

Replaced by

ISO 9455-5:2020PublishedSoft soldering fluxes — Test methods — Part 5: Copper mirror testInternational Standard · Published 2 Oct 2020 · ISO/TC 44/SC 12