ISO/TS 10303-1716:2014Withdrawn

Industrial automation systems and integration — Product data representation and exchange — Part 1716: Application module: Layered interconnect complex template

Systèmes d'automatisation industrielle et intégration — Représentation et échange de données de produits — Partie 1716: Module d'application: Modèle complexe d'interconnexion en couches

This edition has been replaced by ISO/TS 10303-1716:2018.

Abstract / scope

ISO/TS 10303-1716:2014-02 specifies the application module for Layered interconnect complex template.

The following are within the scope of ISO/TS 10303-1716:2014-02:

footprint definition;
footprint definition shape;
padstack definition;
padstack definition shape;
items within the scope of application module Layered interconnect simple template, ISO/TS 10303-1718;
items within the scope of application module Physical unit 2d shape, ISO/TS 10303-1726.

Life cycle

Replaces

ISO/TS 10303-1716:2010WithdrawnIndustrial automation systems and integration — Product data representation and exchange — Part 1716: Application module: Layered interconnect complex templateTechnical Specification · Published 3 Sep 2010 · ISO/TC 184/SC 4

Replaced by

ISO/TS 10303-1716:2018PublishedIndustrial automation systems and integration — Product data representation and exchange — Part 1716: Application module: Layered interconnect complex templateTechnical Specification · Published 18 Dec 2018 · ISO/TC 184/SC 4