ISO 4825-1:2023Published

Fine ceramics (advanced ceramics, advanced technical ceramics) — Test method for thermal property measurements of metalized ceramic substrates — Part 1: Evaluation of thermal resistance for use in power modules

Céramiques techniques — Méthode d'essai pour les mesures des propriétés thermiques des substrats céramiques métallisés — Partie 1: Évaluation de la résistance thermique pour utilisation dans les modules d'alimentation

Abstract / scope

This document specifies a method for measuring the thermal resistance between a heater chip and a cold plate with the heater chip mounted on a metalized ceramic substrate, imitating a silicon carbide (SiC) high-output power module. This measurement represents an index of the heat dissipation characteristics of a metallized ceramic substrate used in a high-output power module.