ISO/TS 10303-1689:2014Withdrawn

Industrial automation systems and integration — Product data representation and exchange — Part 1689: Application module: Interconnect physical requirement allocation

Systèmes d'automatisation industrielle et intégration — Représentation et échange de données de produits — Partie 1689: Module d'application: Attribution d'exigence physique d'interconnexion

This edition has been replaced by ISO/TS 10303-1689:2018.

Abstract / scope

ISO/TS 10303-1689:2014-02 specifies the application module for Interconnect physical requirement allocation.

The following are within the scope of ISO/TS 10303-1689:2014-02:

  • thermal isolation requirement definition;
  • electrical isolation requirement definition;
  • thermal isolation template for substrate design;
  • electrical isolation template for substrate design;
  • length tolerance on spacing requirement;
  • allocation of an isolation requirement to a shield realized as part of an interconnect substrate.

Life cycle

Replaces

ISO/TS 10303-1689:2010WithdrawnIndustrial automation systems and integration — Product data representation and exchange — Part 1689: Application module: Interconnect physical requirement allocationTechnical Specification · Published 3 Sep 2010 · ISO/TC 184/SC 4

Replaced by

ISO/TS 10303-1689:2018PublishedIndustrial automation systems and integration — Product data representation and exchange — Part 1689: Application module: Interconnect physical requirement allocationTechnical Specification · Published 18 Dec 2018 · ISO/TC 184/SC 4