Industrial automation systems and integration — Product data representation and exchange — Part 1689: Application module: Interconnect physical requirement allocation

ISO/TS 10303-1689:2018-11 specifies the application module for Interconnect physical requirement allocation.

The following are within the scope of ISO/TS 10303-1689:2018-11:

• thermal isolation requirement definition;
• electrical isolation requirement definition;
• thermal isolation template for substrate design;
• electrical isolation template for substrate design;
• length tolerance on spacing requirement;
• allocation of an isolation requirement to a shield realized as part of an interconnect substrate.