Abstract / scope
ISO/TS 10303-1698:2014-02 specifies the application module for Layered interconnect module design.
The following are within the scope of ISO/TS 10303-1698:2014-02:
- design features;
- material stackup;
- design patterns;
- metalization;
- functional and physical network listing;
- design layers;
- artwork layers;
- passages;
- items within the scope of application module Assembly component placement requirements, ISO/TS 10303-1634;
- items within the scope of application module Component grouping, ISO/TS 10303-1656;
- items within the scope of application module Edge shape feature, ISO/TS 10303-1673;
- items within the scope of application module Footprint definition, ISO/TS 10303-1646;
- items within the scope of application module Land, ISO/TS 10303-1692;
- items within the scope of application module Layered interconnect module with printed component design, ISO/TS 10303-1700.