ISO/TS 10303-1698:2014Withdrawn

Industrial automation systems and integration — Product data representation and exchange — Part 1698: Application module: Layered interconnect module design

Systèmes d'automatisation industrielle et intégration — Représentation et échange de données de produits — Partie 1698: Module d'application: Conception du module d'interconnexion en couches

This edition has been replaced by ISO/TS 10303-1698:2018.

Abstract / scope

ISO/TS 10303-1698:2014-08 specifies the application module for Layered interconnect module design.

The following are within the scope of ISO/TS 10303-1698:2014-08:

design features;
material stackup;
design patterns;
metalization;
functional and physical network listing;
design layers;
artwork layers;
passages;
items within the scope of application module Assembly component placement requirements, ISO/TS 10303-1634;
items within the scope of application module Component grouping, ISO/TS 10303-1656;
items within the scope of application module Edge shape feature, ISO/TS 10303-1673;
items within the scope of application module Footprint definition, ISO/TS 10303-1646;
items within the scope of application module Land, ISO/TS 10303-1692;
items within the scope of application module Layered interconnect module with printed component design, ISO/TS 10303-1700.

Life cycle

Replaces

ISO/TS 10303-1698:2014WithdrawnIndustrial automation systems and integration — Product data representation and exchange — Part 1698: Application module: Layered interconnect module designTechnical Specification · Published 18 Nov 2014 · ISO/TC 184/SC 4

Replaced by

ISO/TS 10303-1698:2018PublishedIndustrial automation systems and integration — Product data representation and exchange — Part 1698: Application module: Layered interconnect module designTechnical Specification · Published 18 Dec 2018 · ISO/TC 184/SC 4